Recently, Sanan Optoelectronics, CR Micro, Yangjie Technology, StarPower Semiconductor, and five other companies related to third-generation semiconductors successively released their Q3 2026 financial reports, disclosing operational results for the first three quarters and the latest progress in SiC and GaN businesses. Sanan Optoelectronics: Revenue Exceeds CNY 10 Billion in First Three Quarters Sanan Optoelectronics achieved revenue of CNY10.039 billion in the first three quarters of 2026, a y
November 3, 2026
The market typically ranks semiconductor companies by market capitalization and revenue scale. However, an analysis of the Q3 2026 reports reveals that the true value of leading companies lies not in who has higher revenue, but in whose profits withstand scrutiny and whose valuations can be justified. This article uses the top ten A-share semiconductor companies by total market capitalization as a sample, breaking down each company's latest P/E ratios and sell-side target valuations to determine
November 3, 2026
In the broader industry context, this news is hardly a major headline. It involves a silicon carbide (SiC) design company established in 2025, spun off from its parent company's power device business unit to operate independently in the market; and a packaging and testing manufacturer with over thirty years of experience in discrete devices, whose name exudes the steady aura of an old-established brand. The two parties have signed a strategic cooperation intent for SiC discrete MOSFET packaging.
November 2, 2026
In this episode of "Daily SSE STAR Market," we look at SICC (688234). According to the company's Q3 2026 report, revenue for the first three quarters reached CNY 1.559 billion, a year-on-year increase of 40.22%; net profit attributable to shareholders was CNY 27.2162 million, up 2330.24% year-on-year; and net profit attributable to shareholders excluding non-recurring items was CNY 8.8295 million, turning from a loss to a profit. Specifically, in Q3 alone, revenue was CNY 646 million, up 102.89%
November 2, 2026
Recently, Nanya New Material disclosed an announcement stating that to deepen its global strategic layout, enhance the company's comprehensive competitiveness and international influence, and expand diversified financing channels, the company is planning to issue overseas shares (H-shares) and list on the Hong Kong Stock Exchange. Nanya New Material stated that, as of now, the company is discussing relevant work regarding this H-share issuance and listing with related intermediary institutions,
November 2, 2026
On October 19, the Hohhot Economic and Technological Development Zone officially signed an agreement with Xiyue Semiconductor (Beijing) Co., Ltd. The landed project is an "Ultra-High Voltage Power Semiconductor Device Production Project" with a total investment of CNY 558 million. According to the announcement schedule, the project has allocated only a 10-month construction period for itself, planning to commence production in November 2027. In this round of capacity expansion in the power semic
October 25, 2026
In October 2026, Macrocore Semiconductor announced the completion of its Series B+ funding round of hundreds of millions of CNY. Shortly after, the Series B++ round was also closed. The company also revealed that it will launch its Series C round in the fourth quarter, along with the share reform. Wow, Macrocore Semiconductor's rapid-fire series of moves has turned the funding pace into a thrilling drama. Before the audience can even memorize the investor list from the previous episode, the titl
October 23, 2026
At the end of August, Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. ("XMC") released the "Xinguang Plan" for the next decade, targeting 3D storage-computing and optoelectronic integration; at the end of September, the second phase of the advanced packaging pilot platform of Hsingchen Technology, an incubated enterprise of Jiangcheng Laboratory, was officially put into operation, building the first domestic 3D advanced packaging mass production line; in October, HGTECH showcased cutting-edge
October 21, 2026
On October 15, YOFC Advanced Semiconductor Co., Ltd. (YASC) held a technology conference in Shenzhen themed "Beyond the Peak: A Four-Year Technological Long March". The company unveiled a range of innovative achievements, including the latest generation of main drive-level SiC MOSFETs, trench gate technology platform, embedded PCB modules, and diffusion soldering power modules, marking a new milestone in its technological long march. As an invited media outlet, "Hangjia Shuo Sandaiban" attended
October 20, 2026
The story of Jinqiao Equipment Town is just unfolding its prologue. Recently, the 26th China International Industry Fair - Integrated Circuit Exhibition (ICES) opened at the National Exhibition and Convention Center (Shanghai). In the vast exhibition area, the largest exhibitor was not a single company, but a "town". With a booth of nearly 500 square meters, more than 20 companies formed a delegation: etching machines, cleaning machines, metrology and inspection equipment, vacuum valves, probe c
October 18, 2026
On 12 October, the primary market unveiled two major funding announcements on the same day. ChinaVenture exclusively disclosed that AI Infra company Infinigence AI has completed a new round of financing of CNY 2.3 billion, with cumulative financing exceeding CNY 4.3 billion, and has secretly submitted a listing application to the Hong Kong Stock Exchange, with the earliest listing in the first half of 2027; almost at the same time, Pedata reported that RISC-V server CPU company Lanxin Computing
October 17, 2026
Since 2026, diamond semiconductor-related projects have been signed, commenced, or put into production in Inner Mongolia, Gansu, Xinjiang, Henan, and other regions. Provinces and regions such as Jiangsu, Zhejiang, Shandong, Anhui, Shanxi, Hubei, Hunan, and Guangdong have also seen intensive actions. Product directions have extended from industrial diamonds and lab-grown diamonds to diamond single crystals, heat spreaders, and diamond-copper composites. Regional layouts are related to low electri
October 16, 2026
On October 10, Ningbo Deye Technology Co., Ltd. held its 2027 Global Supplier Conference. As a leading domestic inverter manufacturer, Deye is actively adopting silicon carbide (SiC) technology and has already achieved product implementation. During the conference, Deye also disclosed multiple key pieces of information, with two major highlights worthy of industry attention: Procurement demand for 2027 is expected to exceed CNY 18 billion, with core materials including power devices and other mu
October 16, 2026
Recently, two new projects have been added to the upstream single-crystal silicon carbide (SiC) substrate material growth sector, landing in Taiwan, China, and Saarland, Germany, respectively focusing on SiC substrate crystal growth and a new process for high-purity powder preparation. 01. Taiwan's Cinext: 8-inch SiC Substrate Project with an Investment of Approximately CNY 100 Million On October 1, the 35th Science Park Review Meeting of the National Science and Technology Council in Taiwan, Ch
October 16, 2026
As the fourth quarter begins, price increases across the semiconductor supply chain are ongoing. From upstream photoresists and silicon epitaxial materials, to chip segments such as MCU (Microcontroller Unit), analog chips, CPUs, GPUs, and power devices, and further to passive components like MLCCs, semiconductor packaging and testing, and downstream display panels, price hikes have spread across multiple links in the supply chain. Recently, a new batch of vendors has started implementing new pr
October 16, 2026
Recently, domestic companies have achieved process breakthroughs in super junction SiC MOSFETs, while overseas giants have planned to roll out mass production between 2027 and 2031. A technological race over next-generation SiC device structures is now underway. However, for the commercialization of super junction SiC MOSFETs, challenges remain in manufacturing processes, charge balance control, reliability verification, and mass production yield. To gain an in-depth understanding of the actual
October 16, 2026
Recently, another 4 domestic silicon carbide (SiC) enterprises have disclosed their financing progress: Core Energy Semiconductor: Completed over CNY 100 million Series A financing, with key investments in fields such as SiC plastic-encapsulated power modules; Silicon Microelectronics: Completed a Series B financing of hundreds of millions of CNY, and wafer packaging projects for SiC and other materials have been put into production; FORMITEK: Completed a cumulative CNY 170 million financing, an
October 15, 2026
On October 12, Jingneng Microelectronics issued a press release announcing the signing of a Memorandum of Understanding (MoU) with Wolfspeed, specifically highlighting the signing location—the Geely Technology Building in Hangzhou. This partnership is another key move by Jingneng Microelectronics following the completion of its share reform and a CNY 630 million Series C funding round. It also represents a crucial step in the implementation of Wolfspeed's Greater China strategy. This is not a si
October 14, 2026
Recently, YASC announced the convening of its IPO project kickoff meeting, indicating that another domestic silicon carbide (SiC) company is embarking on the listing process. According to observations by "Hangjia Shuo Sandai Ban," since 2025, multiple domestic SiC companies have engaged in the listing process, including SICC, TanKeBlue Semiconductor, Tianyu Semiconductor, Epiworld International, and BASiC Semiconductor. This not only reflects the growth and expansion of SiC companies but also de
October 13, 2026
On October 1, 2026, SmartSens (688213.SH) disclosed the report on the issuance of its private placement, issuing approximately 36.76 million shares at CNY 87.05 per share, raising a total of CNY 3.2 billion. Among the 11 allocated objects, Huaxin Dingxin subscribed for CNY 800 million, and four funds under Zhongyang subscribed for a total of CNY 1.52 billion; Shanghai Feilai Information Technology under the DJI system, Orbbec, and Shanghai International Group Investment Co., Ltd. also participat
October 13, 2026