United Nova Power (UNP) recently announced the completion of its Series C funding round, raising nearly CNY 2 billion. This round was led by China Mobile's Chain Leader Fund, with participation from grid central enterprises, IEIT SYSTEMS, Yuanjing Capital, Sinopec Hydrogen Energy Fund, Naura Technology Nuohua Capital, Jiangfeng Electronics, Changzhou Xingyu, Kaihui Fund, Jianxin Equity, CITIC Jinshi, and other industrial and financial investment institutions. The funds will be used to expand pro
November 3, 2026
Recently, the 16th International Nanotechnology Industry Expo was held at the Suzhou International Expo Center. During this expo, XinShiYe launched the "Q&A · NanoExpo" series of interview reports. This article features an exclusive interview with Pan Yao, General Manager of Suzhou MemsTech Semiconductor Technology Co., Ltd. A layer of silicon, a layer of silicon dioxide, and another layer of silicon—this "three-layer sandwich" structure is essential for silicon photonics chips. According to
November 2, 2026
On October 27, the official website of the Zhengzhou Airport Economy Comprehensive Experimental Zone published an announcement proposing to approve the environmental impact assessment documents for the "NEV Automotive-Grade Silicon Carbide Substrate Production Line Project" by Zhengzhou BYD Auto Co., Ltd. (via the notification and commitment system). According to the public notice, the project is located in the Zhengzhou BYD New Materials Industrial Park. With a total investment of CNY 215 milli
October 30, 2026
[Related Companies Mentioned in This Article] BOE, WG Tech (TGVTECH), Sky Semiconductor, Lens Technology, Rainbow Shares, Triumph Science & Technology, GobiJia, Qibin Group, Corning, SCHOTT, AGC, NEG, MKS Atotech, MacDermid Alpha, Dongwei Technology, Tiancheng Technology, Aisen Shares, Hwatsing Technology, DNP, JNTC, Yoke Technology, Nata Opto-electronic Material, Jiangfeng Electronics, Grinm Advanced Materials, Shanghai Sinyang, Anji Microelectronics, Zhongjuxin, Feikai Materials, Guanghua
October 30, 2026
I. Project Analysis: Details of the CNY 3 Billion Phase II, Stage 2 Plan in Nanjing On October 24, 2026, HT-Tech (002185.SZ), a leading domestic IC packaging and testing enterprise, explicitly responded to market concerns on the Shenzhen Stock Exchange investor interaction platform: The "HT Nanjing Integrated Circuit Advanced Packaging and Testing Industrial Base Phase II, Stage 2 Construction Project," invested with CNY 3 billion by its controlled subsidiary HT-Tech (Nanjing) Co., Ltd., has a c
October 30, 2026
In the microscopic world of semiconductor front-end manufacturing and advanced packaging, Chemical Mechanical Planarization (CMP) equipment is known as the "Planarization Guardian" of Moore's Law. As logic chip process nodes advance to 3nm and below, and with the explosive growth of 3D NAND, High Bandwidth Memory (HBM), and heterogeneous integration technologies, the physical flatness of wafer surfaces has transitioned from the micrometer scale to the sub-nanometer scale. The CMP process not onl
October 30, 2026
Recently, the 16th International Nanotechnology Industry Expo (CHInano) was held at the Suzhou International Expo Center. During this expo, Xinshiye launched the "Q&A @ CHInano" series of interviews, exploring product forms, yield rates, costs, orders, equipment, and ecosystem constraints behind nanotechnology roadmaps. This article features an exclusive interview with Luo Junsheng, Commercial Director of Zhongcai New Materials Research Institute. Testing and analysis are the "eyes" of chip
October 29, 2026
As the global semiconductor market approaches the $1 trillion mark by 2030, the explosive growth of AI computing power and the "memory wall" bottleneck are driving chip manufacturing toward new architectures, new materials, and three-dimensional heterogeneous integration. At the recently concluded WESEMiBAY 2026 · International Semiconductor Equipment Technology and Process Forum, top technical leaders from global and domestic semiconductor equipment sectors gathered together. Attendees included
October 29, 2026
Author: Xiao Meng As AI chips continue to evolve, Advanced Packaging has become a ubiquitous topic. TrendForce recently released a report assessing the competitive landscape of Advanced Packaging for AI chips. The report indicates that although solutions such as Intel's EMIB-T are vying for AI chip customers, TSMC's CoWoS-L is expected to remain the mainstream Advanced Packaging solution for AI chips through 2028, thanks to its technological maturity and yield advantages. This assessment implies
October 29, 2026
Etching is one of the most critical equipment types in chip manufacturing. According to MIR DATABANK data, China's domestication rate for etching equipment (calculated by sales revenue) reached 41% in Q2 2026, with a full-year forecast of 45%. This indicates that local vendors have secured the majority of new orders for mature process nodes, but substitution in high-end segments such as advanced logic and 3D NAND has only just begun. At the same time, the U.S. "MATCH Act" proposes a 75% self-suf
October 28, 2026
On October 26, Hunan Titan Future Technology Co., Ltd. announced the development and production of China's first 12-inch polycrystalline silicon carbide (SiC) substrate. According to reports, this material achieves a thermal conductivity of over 280 W/(m·K), more than twice that of traditional silicon-based materials. It is primarily targeted at AI computing chips and advanced packaging, serving as a heat-spreading substrate within package structures to mitigate heat accumulation during the oper
October 27, 2026
On October 15, TAISIC Materials, a Chinese Taiwan-based silicon carbide (SiC) substrate company, officially entered the TPEx Emerging Stock Market (Xinggui), becoming the first company in the Taiwan region to list on this market with SiC materials as its core business. According to information from "Third-Gen Semiconductor Insights", TAISIC Materials issued 90 million common shares at a reference price of TWD 35 per share (approximately CNY 7.17). Recently, the company's share price has ranged b
October 27, 2026
Domestic advanced packaging capacity expansion gains further momentum. On October 24, HT-Tech (002185.SZ) confirmed on the Shenzhen Stock Exchange's interactive platform that its Nanjing subsidiary is advancing the Phase II, Stage 2 project of the IC Advanced Packaging and Testing Industrial Base. With a total investment of CNY 3 billion, the project targets the storage chip packaging and testing sector to strengthen domestic supply chain capabilities. In May this year, HT-Tech announced the app
October 27, 2026
Recently, news of a bankruptcy review has unearthed a forgotten chapter in Hunan's semiconductor industry history. Changsha Chuangxin Integrated Circuit Co., Ltd. has been added to a new bankruptcy review case, with the case number (2026) Xiang 01 Po Shen No. 242. The applicant is Changsha Economic and Technological Development Group Co., Ltd. This 6-inch foundry, once heavily relied upon to shoulder the expectations for local wafer manufacturing in Hunan, has officially entered bankruptcy proce
October 27, 2026
This year marks APEC China Year. From November 18 to 19, the 33rd APEC Economic Leaders' Meeting will be held in Shenzhen. The theme is "Building an Asia-Pacific Community, Promoting Common Prosperity," with openness, innovation, and cooperation listed as the three priority areas. For the Greater Bay Area (GBA), the region with the highest density of manufacturing in China, this is also an opportunity to showcase its industrial strengths to the Asia-Pacific region. On October 20, ahead of the AP
October 26, 2026
Author: Xiao Meng Recently, silicon carbide (SiC) has been gaining increasing prominence in the semiconductor industry. As a wide bandgap semiconductor material, it offers lower energy conversion losses than traditional silicon under high-voltage, high-temperature, and high-frequency switching conditions, helping electronic systems improve efficiency. Consequently, it continues to penetrate applications such as NEVs, photovoltaics, energy storage, and industrial power supplies. According to rese
October 26, 2026
Author: Junxi On October 21, Canon disclosed its capacity expansion plan, with the production volume of semiconductor lithography equipment next year expected to reach nearly double this year's level at most. Just a day prior, Nikon announced the initiation of R&D for higher-precision digital lithography equipment, continuing its layout in the Advanced Packaging market. A week ago, global lithography equipment leader ASML disclosed in its third-quarter earnings report that customer demand fo
October 26, 2026
On October 19, Shenzhen MicroView Advanced Packaging Technology Co., Ltd. completed the tutoring filing registration with the Shenzhen Securities Regulatory Bureau, with Huatai Lianhe Zhengquan acting as the tutoring sponsor. Founded in December 2019, the company is not yet seven years old. This pace is considered fast in the semiconductor equipment industry. | 500% Lei Weizhuang, the founder and chairman of MicroView, has been engaged in high-precision packaging for over 20 years. Recently, on
October 22, 2026
On 20th October, SICC (688234) released its Q3 2026 financial report, presenting highly impressive data: The cumulative revenue for the first three quarters reached CNY 1.559 billion, a year-on-year increase of 40.22%, while net profit surged by 2330.24% year-on-year. Revenue for Q3 alone reached CNY 646 million, up 102.89% year-on-year, with the revenue share of 8-inch products also breaking through the 50% mark. However, on the first trading day after the report's release, its A-share stock pr
October 22, 2026
[Relevant Companies Involved in This Article] ASE, Amkor, JCET, TFME, HT-Tech, PTI, Wise Road, Hana Micron, KYE, SJ Semiconductor, Mega Wide, ChipMOS, USI, QZ Technology, Union Semiconductor, China Wafer Level Csp, ECHINT Technology, SiPTORY, Fozhixin Microelectronics, XMC, Tiancheng Advanced Semiconductor, NCAP China, Hsingchen Technology, DF Compute, YMTC, WY Semiconductor, DSHX Technology, Padixon, BIWIN Storage Technology, TSMC, GlobalFoundries, Intel, AMD, Sony, Piotech, NAURA, iSABers, Wis
October 22, 2026
